8329TFF-25ML

8329TFF-25ML is a fast cure thermal adhesive. This thermal epoxy glue is a 2-part, 1-1 system with a set time of only 15 minutes. It is a smooth off-white paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. It is UL 94V-0 registered as flame retardant (UL File# E334302). It bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies. Thermal glue is often used to bond heatsinks to CPUs. It may also be used to glue heatsinks to LEDs and other electronic components, and in many other applications that require a fast setting, thermally conductive, electrically insulating adhesive.

• Thermal conductivity of 0.8W/(m·K)
• 1:1 mix ratio
• Working life of 5minutes
• Set time of 15minutes
• Provides strong electrical insulation
• Low CTE prior Tg
• High tensile and compressive strength
• Strong resistance to humidity, salt water, mild bases and aliphatic hydrocarbons
• 25ml in volume