HTSP50T

HTSP50T is a Silicone heat transfer compound(paste) plus in 50ml tube. This is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components. HTSP is based on a silicone oil, offering an exceptionally wide operating temperature range.

• High thermal conductivity, optimum efficiency of heat dissipation
• Very low viscosity for ease of application, designed for use as a thermal interface material
• Based on a silicone oil, offers an exceptionally wide operating temperature range
• Non-curing paste, allows simple and efficient rework of components if required
• Pale grey in colour
• Silicone oil base
• Powdered metal oxides thermo-conductive component
• Temperature range from -50°C to +200°C
• 3g/ml density at 20°C and viscosity of 42 to 48Pas at 1rpm
• 18KV/mm dielectric strength